This advanced course will introduce the user to the thermoset injection molding module (reactive molding). The course will introduce the reactive and transfer molding process, and how Autodesk Moldflow Insight simulated the mold filling and curing process. Additionally, the course will discuss the unique attributes of encapsulation molding of micro-chips.
Finally, the LSR molding process will be covered, and the key mold filling results will be reviewed.
After the class, the user will have an understanding of:
- The difference between thermosets and thermoplastics
- Reactive Molding Module for both Injection Molding and Transfer Molding
- Injection Molding simulation of LSR materials, and how to set up a mold filling and packing simulation
- The important material characteristics for thermoset materials
Who Should Attend?
- Product Designers Using Thermoset Resins
- Autodesk Moldflow Insight Users
- Electronics Designers
- Mold Designers
- (Both New and Experienced) Process Engineers
Prerequisite
This course is available for "remote" learning and will be available to anyone with access to an internet device with a microphone (this includes most models of computers, tablets). Classes will take place with a "Live" instructor at the date/times listed below.
Upon registration, the instructor will send along additional information about how to log-on and participate in the class.
